InnovationsForum 2015

Save the date! March 10, 2016, Kongresshalle Boeblingen

InnovationsForum EPP/ EMSNow 2016

3rd Innovations-Forum Variant Management in the Handling of Components

When it comes to innovation, being ahead of your competitors can ensure crucial advantages for your company.

However, the development and implementation of innovation has evolved during recent years and today begins where human beings and scientific knowledge collide: a successful innovation process now demands that structural aspects comply with human needs and requirements.

The overarching theme for the 3rd Innovations-Forum in Böblingen addresses 'Opportunities for Electronics Manufacturing in Germany through Industry 4.0' with an emphasis on variant management in the handling of components. Leading companies and top-level experts will present their solutions and practical advice during the one-day event.

The 3rd Innovations-Forum will focus on the practical challenges faced by the growing diversity of components. Increasing miniaturisation and complexity present a multitude of challenges for manufacturers of equipment and software, as well as electronics service providers. Together we aim to address, rectify and overcome the obstacles present in the process of innovation.

The Forum is scheduled to take place at the Böblingen Kongresshalle on the 12th March, 2015.

The day's itinerary will offer interesting presentations with reference to innovative products, a round table discussion with experts and a keynote speaker.  

This year's keynote speaker is Dr. Walter Döring, former Minister of Trade and Industry and CEO of ADWM GmbH (Akademie Deutscher Weltmarktführer).

With our sponsors (Aegis Software, ASM Assembly Systems, Asys Automatisierungssysteme, ATEcare Service, Christian JKoenen, Ersa, Eutect, Factronix, Koh Young Europe, Nordson Dage, Rehm Thermal Systems, Seho Systems, Viscom, Yamaha and Yxlon), industry leading and leading companies have joined forces to discuss and find solutions to a variety of issues.

A key focus of the Forum is the exchange of ideas and experience among all participants and attendees, speakers, and sponsors will have ample opportunity for discussions with experts in the field.

You are invited to take advantage of this opportunity to meet the experts and innovators who will provide you with possibilities and solutions.

This unique networking platform for the exchange of information and ideas will provide you with the knowledge and tools to help develop your competitiveness in Germany!

Further information about the event can be found at

We look forward to seeing you in Böblingen!

Language of event: German.

Registration here

Sponsors 2015

Presentations 2014

Keynote Dr. Ulrich Guddat, Porsche Consulting GmbH, Bietigheim-Bissingen

Demands and Solutions to keep competitiveness of electronic Manufacturing in Germany

Hans-Jürgen Lütter, General Manager, ANS answer elektronik Service- & Vertriebs GmbH

Saving with stencil printing

Harald Grumm, Head of Application, Christian Koenen GmbH

“Industrie 4.0”: The first steps towards implementation have already been taken

Hubert Egger, Siplace Product Marketing Manager Software, ASM Assembly Systems GmbH & Co. KG

Everything at a glance with „Mobile Line Assist“

Jürgen Lehner, Product Manager Handling, Asys Automatisierungssysteme GmbH

Wie wurden und werden Ergebnisse aus diversen Inspektionsbereichen in der Elektronikfertigung verwertet? Was bringt uns die Zukunft?

Olaf Römer, Managing Director, ATEcare Service GmbH & Co.KG

ProDEK and MES – the DEK option for intelligent printer networking that reduces production costs and increases productivity

Jens Katschke, Business Development Alternative Energy & Solutions Engineering Manager Europe, DEK Printing Machines GmbH

Industry 4.0 - Hype or constant evolution?

Dipl.-Ing.(FH) Jürgen Friedrich, Manager Application Technology, Ersa GmbH

Kosten, Effektivität und Qualität prägen die Wettbewerbsfähigkeit von Elektronikproduzenten in Europa

Harald Eppinger, European Sales Manager, Koh Young Europe GmbH

Process Control: Basis for an Efficient Selective Soldering Process

Heike Schlessmann, Head of Technical Marketing, SEHO Systems GmbH

Industry 4.0 Drives The Need For ERP Enhancement In Electronics

Bjorn Thordsen, Business Manager für die EMEA Region, Mentor Graphics Corporation

Solder Paste Jetting, an alternative or add on tool for paste deposition

Nico Coenen, Global Sales Director Jet Printing, MYDATA Royonic GmbH

Innovative Lösungen für thermische Systeme

Dr. Hans Bell, Head of the Development and Technology department, Rehm Thermal Systems GmbH

Innovations in Final-Assembly Automation for Greater Productivity and Quality

Dipl.-Ing. (FH) Ulf Neyka, Sales manager for the German-speaking countries, Yamaha Motor IM Europe GmbH

Closing discussion


Getting there

Kongresshalle Böblingen


71032 Böblingen  

Phone: +49 7031-4911-0

Avenue click here 

Alle Rechte vorbehalten
Vervielfältigung nur mit Genehmigung der Konradin Mediengruppe