Omron Europe B.V. announced the launch of the VT-X700 inline high speed 3D x-ray inspection system. The news inline x-ray was demonstrated at Electronica 2010 in Munich and attracted a great deal of interest. The company use high definition CT reconstruction images to inspect a wide variety of component types from BGA to chip. By using 3D reconstruction, automatic defect analysis is extremely accurate and fast with a BGA inspected in less than 5 seconds. PCB warp compensation is also performed for each solder joint, ensuring that the slice level is automatically detected correctly. The system uses a closed x-ray tube keeping maintenance to a minimum. An important feature for inline x-ray required to operate 24/7. Compatible with QupNavi process control software of the company enabling total line optimisation. The software takes information and image data from SPI, AOI and AXI to provide details process analysis and allows engineers to identify and eliminate apparently random process errors.